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气相回流焊Asscon动态分析
来源: fbe-china.com作者: Kenny Fu时间:2019-11-18 15:19:17点击:8848

A-Tek Systems Group is pleased to announce the release of Dynamic Profiling, engineered and developed by Asscon Systemtechnik, the innovative industry expert and leader in vapor phase reflow technology. Dynamic Profiling feature is a tool to allow for the automatic adjustment and control of reflow profiles.

Now offered on the Asscon VP1000 and VP6000 platforms, the Vapor Phase Dynamic Profiling feature will significantly simplify the set up and preparation of various temperature reflow profiles, while eliminating any possible interferences due to different loads or usage conditions. The user will merely determine the desired temperature profile and key in the values to the PLC user interface.

Regardless of step profile or linear profile, the user can create a soldering program by determining the: Start soak temperature in o C Duration ramp Time above liquidous

The Dynamic Profiler will automatically determine the control parameters for the profile(s), by utilizing three temperature reference measuring points embedded into the Vapor Phase System. The reference points, 1/2/3 are used for permanent control and monitoring of the profile. The controller will use the temperature behavior of the selected reference measuring points to start the appropriate control actions during profiling.

Sample Profiles

Linear - TC1 was used for process control. The measurements show excellent correlation of the control sensors to be soldered with the product.

Figure 2: Linear Profile

Ramp- TC2 was used for process control. The measurements shows agreement with the product being soldered. The soldering program in a holding zone of 160o C was programmed. The boards were measured between 160o C and 165o C (maximum).

Figure 3: Ramp Profile

Leaded profile driven in contact with a lead-free process media - The measurement standard 2 was used for process control. The maximum product temperature must be limited to 215o C. The measurements show the product with a maximum temperature 211o - 213o C. The process fluid used for the trial was rated at 240o C.

Figure 4: Leaded Profile

A-Tek Systems Group was established in 2004 to market high quality, value-add PCB assembly equipment. A-Tek is the National Distribution partner for Asscon. Other products marketed by A-Tek include PCB depaneling (Getech), Selective Soldering (Ebso) and PCB Cleaning (Kolb). Headquartered out of Longmont CO, A-Tek provides 24/7 technical support and spare parts to customers in North America, Canada and Mexico.

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