Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch, European X-Ray Application Engineer, will present at their Distributor Eteks Technology Event, scheduled to take place November 5-6, 2014 in Prestwick, Scotland. Koch will present Failure Analysis with X-Ray in 2D, Tomosynthesis and CT.
Mr. Koch will discuss failures on BGAs, HiP (Head in Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection; however, sometimes it is necessary to use other techniques such as X-Plane (Tomosynthesis) and CT. Also, Koch will discuss how the shape of the BGA balls or the voiding can give a good indication of the failure.
The presentation will analyze failures on different components such as resistors, capacitors and wire bonds. Nordson DAGE X-Plane and CT-images will be shown. Mr. Koch will conclude with an example of how useful X-ray can be to find a manipulation on a device.
Peter Koch studied the Science of Materials at the Technical University in Erlangen-Nuuml rnberg, Germany. He is Nordson DAGEs European X-Ray Application Engineer and has worked for the Company for the last ten years.
For more information about Nordson DAGE, visit www.nordsondage.com.
