SMT Hybrid Packaging 2014 will be the launch pad for SolderStars new OvenProbe device, a system designed for the measurement of a conventional reflow ovens performance.SolderStar, a world leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, will present OvenProbe to the market for the first time at the show in Nuremberg, Germany from 68th May.The show is the perfect platform in which to introduce the device to the industry, and will give us the opportunity to create awareness of OvenProbe and gain opinion from industry leaders,explains Mark Stansfield, managing director at SolderStar Ltd.OvenProbe is our latest development and measures performance of conventional reflow ovens. It is designed for use after machine maintenance to benchmark the machines thermal transfer performance,continues Mark.It offers three matched thermal masses at the top and bottom which measures oven uniformity across the conveyor width, allowing the top and bottom heaters effects to be measured. There are also large thermal masses installed which will quantify the heating capability of the oven. In addition air temperature sensors have been fitted to allow heater and speed measurements to take place, making OvenProbe an effective and proficient addition to any reflow oven.Along with OvenProbe, SolderStar will exhibit a number of its newest tools for all aspects of reflow measurement, one such product is the new SolderStar APS, a full time system for profiling each and every PCB soldered in a convection reflow oven. The system is tailored for, and fitted, to a customers oven so their requirements are met precisely. Special temperature probes are mounted along the heated length on both sides of the machine to monitor actual product level temperatures in real time. In addition to this the system keeps track of the current speed and position of each assembly in the process.SolderStar will present a range of its thermal profiling equipment, accessories and software, at SMT Hybrid Packaging. As well as the OvenProbe and APS systems, conventional reflow and VP product profilers will be demonstrated. There will also be soldering accessories like the DeltaProbe, which removes the need to use fragile test boards for periodic profiling required for ongoing control of the reflow process on the stand.SolderStar will be in Hall 9 stand 323. If you would like further information or to arrange a consultation at the show contact Solderstar.
