Multitest, announces that experts for 3D IC test will present at the European 3D TSV Summit in Grenoble, Jan 20-22, 2014.
In Session 4 SUPPLY CHAIN READINESS FOR HVM, on Tuesday January 21 Multitest experts will talk about Test strategies for 2.5 3D. In the following panel Multitest will discuss about 2.5D Interposer Supply Chain: Ready for HVM? together with TSMC, STATS Chip Pac and Oerlikon Systems.
The European 3D TSV Summit will focus on the theme Application Ready, addressing 3D TSV from both a business and technology perspective. It will demonstrate the full range of 3D technology and RD processes, with leading companies participating, showing a range from initial prototypes to high-volume production.
The latest TSV product developments and achievements including cost, business models, supply chain, manufacturability and technology aspects will be addressed by executives and experts from global companies.
To learn more about this conference visit http://www.semi.org/eu/node/8566
