Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitests experts to learn more about the companys solutions, from wafer-level test to final test for standard ICs and sensor packages.
Multitest sensor test modules combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS test market. Multitest offers solutions for a variety of sensor test applications, for singulated devices as well as cost-efficient strip tests and the latest test strategy: test in carriers. Based on the modular concept, a combination of different stimulus boxes within one MEMS module is possible. This allows testing of up to 9 degrees of freedom in one test setup. Testing of complex MEMS devices with only one test insertion.
Multitests leading fab capabilities ensure cost-effective solutions for high layer count and fine-pitch boards. Thoroughly defined processes ensure dependable on-time delivery. Multitest key differentiators are:high aspect ratio process UltraFlattrade; process unique gold plating processes: DuraPadtrade;, ENCAP and Direct Attach advanced fine-pitch drilling processes flat smooth via fill
Multitest Quad Techtrade; applies a next-generation barrel-less architecture for vertical probes. The unique design provides a large compliance window, high bandpass and unsurpassed contact integrity. The architecture is based on a dual-fork design that features a redundant, permanent bias. All surfaces are open and planar and, therefore, have ideal plating quality. The Quad Techtrade; design is scalable to support fine-pitch applications.
