Microtronic GmbH, a leading sales specialist of microelectronics, announces that it will showcase its LBT-210 Solderability Tester in Hall 9, Booth 304A at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Microtronics LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets todays current industry challenges. The system is operated by using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.
Additionally, Microtronic will showcase the following product lines:EVS International ― Solder recovery systems Sonix ― Echo - Ultrasonic Microskope Seit ― HF Induction Soldering Systems Akrometrix AIM ― Specialty SoldersAPE ― Repair equipmentAIT ― Heater bars and Electrodes
For more information, please speak with a Microtronic representative in Booth 9:304A during SMT Nuremberg 2013
