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预测2012年半导体设备销售额为382亿美元
来源: fbe-china.com作者: Kenny Fu时间:2019-11-03 20:07:16点击:1568

SEMIprojectsthatworldwidesalesofnewsemiconductormanufacturingequipmentwillreach$38.2billionin2012,accordingtotheyear-endSEMISemiconductorEquipmentConsensusForecast,releasedheretodayattheannualSEMICONJapanexposition.Followingamulti-yearexpansionperiod,semiconductorequipmentsalesareexpectedtomoderatebeforepostinglowdouble-digitgrowthin2014.

Aftera151percentmarketincreasein2010anda9.0percentincreasein2011,theequipmentmarketisexpectedtocontractby12.2percentin2012.Growthisexpectedinjusttworegionsin2012Taiwan(12.7percentincreaseover2011)andSouthKorea(10.7percentincrease).In2012,TaiwanandSouthKoreaeachwillreachequipmentsalesof$9.6billion,withNorthAmericansalestotaling$8.0billion.RestofWorld(ROW),Europe,andJapanarethemostnegativelyimpactedin2012.

In2013,China,TaiwanandJapanareexpectedtohaveslighttomoderatepositivegrowth.Whiletheoverall2013forecastindicatesanother2.1percentreductioninsales,2014salesareexpectedtoreboundincreasing12.5percentwithallregionsincreasingsales.

Salesofsemiconductormanufacturingequipmentin2012reflectsignificantinvestmentsoverthepriortwoyears,normalpatternsofindustrycyclicalityandaslowdowninthebroadereconomy,saidDennyMcGuirk,presidentandCEOofSEMI.Whatsmoreimportantisthattechnologyinvestmentsattheadvancednodesandinleading-edgepackagingremainimportantdrivers,andwhenmarketconfidencereturns,weexpectcapacityinvestmentstoincrease.

Waferprocessingequipment,thelargestproductsegmentbydollarvalue,isexpectedtodecrease14.8percentin2012to$29.3billion,andremainatapproximatelythatsamelevelin2013.Theforecastpredictsthatthemarketforassemblyandpackagingequipmentwilldeclineby5.1percentto$3.2billionin2012.Themarketforsemiconductortestequipmentisforecastedtodeclineby4.8percent,reaching$3.6billionthisyear.Onthepositiveside,theOtherFrontEndcategory(fabfacilities,mask/reticle,andwafermanufacturingequipment)isexpectedinincrease6.3percentin2012.

ThefollowingresultsaregivenintermsofmarketsizeinbillionsofU.S.dollarsandpercentagegrowthovertheprioryear:

Source:SEMIDecember2012

Note:Totalsandpercentagesmaydifferduetoroundingofnumbers

TheEquipmentMarketDataSubscription(EMDS)fromSEMIprovidescomprehensivemarketdatafortheglobalsemiconductorequipmentmarket.Asubscriptionincludesthreereports:themonthlySEMIBook-to-BillReport,whichoffersanearlyperspectiveofthetrendsintheequipmentmarket;themonthlyWorldwideSemiconductorEquipmentMarketStatistics(SEMS),adetailedreportofsemiconductorequipmentbookingsandbillingsforsevenregionsandover22marketsegments;andtheSEMISemiconductorEquipmentConsensusForecast,whichprovidesanoutlookforthesemiconductorequipmentmarket.Formoreinformationortosubscribe,pleasecontactSEMIcustomerserviceat1.877.746.7788(tollfreeintheU.S.)or1.408.943.6901(InternationalCallers).

SEMIistheglobalindustryassociationservingthenano-andmicroelectronicsmanufacturingsupplychains.Our2,000membercompaniesaretheengineofthefuture,enablingsmarter,fasterandmoreeconomicalproductsthatimproveourlives.Since1970,SEMIhasbeencommittedtohelpingmembersgrowmoreprofitably,createnewmarketsandmeetcommonindustrychallenges.SEMImaintainsofficesinBeijing,Bengaluru,Berlin,Brussels,Grenoble,Hsinchu,Moscow,SanJose,Seoul

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