IndiumCorporationtechnologyexpertssharedtheirtechnicalexpertiseattheInternationalMicroelectronicsandPackagingSymposium2012(IMAPS)inSanDiego,CA,heldSeptember11ndash;13,2012.
Ning-ChengLee,PhD,VicePresidentofTechnologypresentedtwotechpapers:
HighReliabilityHighMeltingLead-FreeMixedBiAgXSolderPasteSystemreceivedtheIMAPS2012BestinSessionAward,andwasco-authoredbyResearchMetallurgistHongwenZhang.Thispaperexplainstheresearchinvolvedinidentifyinglead-freealternativesforhighmelting,highleadsolderalloys.Alsodiscussedareanovelhighmeltinglead-freeBiAgXmixedsolderpastesystem,andacomparisonofitsperformancetoseveralrepresentativehighleadsolderalloys.Thispaperisavailablefordownloadfromthislinktoourtechnicallibrary.
SuperiorDropTestPerformanceofBGAAssemblyUsingSAC105TiSolderSphereexplorestheboard-leveldroptestperformanceoffourdifferentsoldercombinationsinBGA/CSPassembly.ThedataderivedfromthisresearchhelpstounderstandthefailuremechanismandperformanceofvariousPb-freealloys.Thispaperisavailablefordownloadfromthislinktoourtechnicallibrary.
Dr.LeealsotaughttheprofessionaldevelopmentcoursePackageonPackageTechnology-Whatisit,WhatWorks,WhatDoesntWork.
RonaldC.Lasky,PhD,PE,SeniorTechnologist,andSethHomer,ProductSupportSpecialist,co-chairedthe:
Pb-FreeSolderandRoHSsession.ThissessionfocusedontheprocessandreliabilityimprovementinlightoftheongoingpushtowardsPb-freeandRoHScompliance.
Dr.Leeisaworld-renownsolderingexpertandanSMTAMemberofDistinction.Hehasextensiveexperienceinthedevelopmentofsolderpastes,fluxes,high-temperaturepolymers,encapsulantsformicroelectronics,underfills,andadhesives.Hiscurrentresearchinterestscoveradvancedmaterialsforinterconnectsandpackagingforelectronicsandoptoelectronicsapplications,withemphasisonbothhigh-performanceandlow-costofownership.Dr.LeeisalsoamemberoftheSMTAIplanningcommittee.
Dr.Lasky,holderoftheprestigiousSMTAFoundersAward,isaworld-renownprocessexpertandanInstructionalProfessoratDartmouthCollege.Hehasover25yearsofexperienceinelectronicsandoptoelectronicpackagingandassembly.Hehasauthoredoreditedfivebooksandnumeroustechnicalpapersandholdsseveralpatentdisclosures.Dr.Laskyalsoauthorsatechnologyblog
SethHomeristheproductsupportspecialistforEngineeredSolderMaterials.HehasbeenwithIndiumCorporationforover15years,servingasmanufacturingsupervisorforvariousengineeredelectronicsassemblymaterials,including:solderspheres,sputteringtargets,indiumchemicals,andsolderpreforms.SethhasworkedextensivelywithIndiumscustomersupportteams,especiallythoseinChina,Singapore,andEurope.
IMAPSisthelargestsocietydedicatedtotheadvancementandgrowthofmicroelectronicsandelectronicspackaging.IMAPSproducesnumerouspublications,workshops,internationalconferences,professionaldevelopmentcourses,andexhibitionsthatbringtogethertheentiremicroelectronicssupplychain.Eventsandproductsfocusonthosetechnologiescriticaltothepresentandfutureofmicroelectronics:3Dintegration,MEMS,flipchip,waferlevelpackaging,thermalmanagement,printedelectronics,advancedmaterials,photonics,modeling/design,aswellasmanyothers.
IndiumCorporationisapremiermaterialssuppliertotheglobalelectronics,semiconductor,solar,thin-filmandthermalmanagementmarkets.Productsincludesolders,preforms,andfluxes;brazes;sputtertargets;indium,gallium,andgermaniumchemicalsandsourcing;andReactiveNanoFoilreg;.Foundedin1934,IndiumCorporationhasglobaltechnicalsupportandfactorieslocatedinChina,Singapore,SouthKorea,theUnitedKingdom,andtheUSA.
