SEHO North America, Inc. announces a two-day seminar from the SEHO Academy, scheduled to take place September 18-19, 2013 in Cincinnati, Ohio. The event has been organized in cooperation with John Borneman from Delphi Electronics and Safety, Friedrich-Alexander University Erlangen Nuremberg, the Balver Zinn Group Germany and Pink GmbH Germany.
The first day of the seminar will focus on the Reflow Soldering Process Now and in the Future. Reflow experts Andreas Reinhardt, Stan Renals and Andrea Althaus will discuss new and existing trends and materials in reflow soldering. A particular focus will be on void-free solder connections.
The second day will concentrate on selective and wave soldering, providing comprehensive process knowledge. A special focus will be on practical hands-on training and equipment maintenance. After the introductory presentation from John Borneman the attendees will be separated in two workshop groups focusing on either selective or wave soldering.
As part of the successful SEHO Academy with more than 1,000 satisfied attendees worldwide, the event will highlight latest technology for quality enhancement. As a result, participants will realize a higher level of profitability.
For more information, visit www.sehona.com.
