The SMT in Nuremberg has traditionally been an important trade show for LPKF. This year laser systems will be shown on three stands, and a world premiere will demonstrate LPKs innovative power as the specialist in micro material processing with lasers.
Anyone interested in laser technology and almost production-ready PCB prototyping should visit LPKF Laser Electronics AG at Stand 320 in Hall 6, where the company will be presenting its complete line for easy and efficient PCB prototyping. The latest generation of the proven circuit board plotters and the professional SMT assembly line (stencil printer, manual assembler, and reflow oven) will supplement the trade show exhibits. The ProtoLaser U3 laser cutting and structuring system provides a much wider range of applications and materials. The latest version even enables high-precision structuring of laminated PCB materials.
LPKF will present a world premiere at the main stand (H6/320): The LPKF MicroLine 6000 P UV laser cutting system, which was completely revised and now features a more ergonomic user interface design, an extended part detection system, and automated beam correction. Power sensors record and, if necessary, adjust the laser energy at the material surface. Positional corrections compensate for deviations in the laser beam through active elements in the beam path. This lessens environmental effects during machining and ensures a continuously high level of preci-sion. Time-consuming calibration during commissioning and component replacement is no longer necessary this task is now performed by the laser system.
A sister model can be seen in action at Stand 434 in the same hall (Hall 6). LPKF is participating in the SMT Hybrid Packaging 2012 production line under the leadership of Fraunhofer IZM. The LPKF MicroLine 6000 S laser depaneling system accurately cuts assembled boards out of a panel without mechanically or dynamically loading the delicate structures or components.
LPKF will also take part in the 3D-MID e.V. joint exhibition stand (Stand 226 in Hall 6) with a laser structuring system from the Fusion3D-1000 family on the 3D-MID production line. With this low-cost laser system, injection-molded plastic parts can be structured using the LDS process. The LPKF ProtoPlate LDS will also be presented to show how a subse-quent metallization process can be used to turn simple plastic compo-nents into high-quality 3D circuit substrates.
The LPKF stand attracted numerous visitors in 2011 with the latest infor-mation on rapid PCB prototyping and laser production systems.
Laser technology in production: Thomas Nether explains the function and advantages of laser depaneling using the LPKF MicroLine 6000S laser depaneling system on the IZM production line.
About LPKF
LPKF Laser Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
