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Photo Stencil的海报获评IPC APEX EXPO 2011最佳
来源: fbe-china.com作者: EM Asia China时间:2019-11-21 17:19:56点击:1834

Colorado Springs, CO - May 5, 2011 - Photo Stencil, a leading full-service provider of high-performance stencils and tooling, announced that the poster presented by Dr. William Coleman, titled Stencil Design for Broadband Printing (Very Small and Normal Components on the Same PCB), was chosen by the Technical Program Committee of IPC as Best Poster of the Technical Conference for the 2011 IPC APEX Expo, held April 12-14, 2011 in Las Vegas, NV. IPC-Association Connecting Electronics Industries celebrates the best of electronic interconnection research being conducted by both industry leaders and academia.

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