Indium Corporationrsquo;s Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will present at Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, NY USA. Dr. Leersquo;s presentation will be on the topic of lead-free system compatibility. Dr. Lasky will be speaking on applying SPC to surface mount manufacturing. The workshop, sponsored by SMT Magazine and RITrsquo;s Center for Electronics Manufacturing and Assembly (CEMA), will focus on lead-free rework and repair; failure analysis technologies for process engineers; tin whisker mitigation; lead-free system compatibility; IPC-7711 certification; and RoHS traceability, certification, and compliance. Dr. Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost ownership. Dr. Lasky, holder of the prestigious SMTA Founderrsquo;s Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 20 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. For more information and to sign up for the workshop, visit www.smtmag.com For more information about Indium Corporation visit www.indium.com or email askus@indium.com.
