The IPC Solder Products Value Council (SPVC) announced that it has prepared a research paper on solder joint voids for lead free solder. The research paper is based on the results of a three-year, million dollar reliability test program for the tin, silver, copper family of lead free alloys. ldquo;We have excellent data on the effects of solder joint voids on solder joint reliability for the tin, silver, copper alloy family,rdquo; Karl Seelig, vice president of technology, AIM Inc. and chair of the SPVC Technical Subcommittee, explained. Seelig stressed that the IPC SPVC research report, issued three months ago, was very clear on lead free voids. He said that one of the key conclusions of the research report was: ldquo;Based on the comparison of the number and size of solder joint voids to thermal cycle interconnection failure date, there is no evidence that solder joint voiding has any significant impact on solder joint reliability.rdquo; However, this conclusion was secondary to the goal of the research report which was to determine if the there was any difference in reliability between the tin/silver/copper alloy family. The research study reported there was no difference and went on to recommend the SAC305 (96.5 percent tin, 3.0 percent silver, 0.5 percent copper) lead free alloy. Seelig said, however, significant details on the much debated lead free voiding might have been lost in the overall scope of the report. ldquo;Thatrsquo;s the reason the council has published a special report specifically on solder joint voids for lead free solder. We have the data and it was only a matter of reformatting it for easier analysis.rdquo; The SPVCrsquo;s special report on lead free voiding is posted as a free download on IPCrsquo;s members-only website (www.ipc.org). In addition, the report can be obtained by contacting members of the IPC SPVC Technical Subcommittee.