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Kyzen在NEPCON华南展荣获“最佳论文奖”
来源: emasia-china.com作者: Kenny Fu时间:2019-11-27 17:25:48点击:5338

Kyzen announces that it received a Best Paper award for its recent presentation during NEPCON South China, which was held from August 27-29, 2013. Part of the SMTA China 2013 Technology Conference sponsored by SMTA China South, Kyzens presentation was given by Jason Chan, Kyzens Asia technology manager, and took place at the Shenzhen Convention Exhibition Center in Shenzhen, China.

The topic of the presentation was Stencil Printing Yield Improvement Capabilities and discussed the fact that stencil printing capabilities are becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.

Jason also explained how the wide range of required solder paste volume deposited on mixed technology assemblies is pushing traditional stencil design rules to their limit. There is a need for improved stencil, printing and materials technologies to increase the consistency of the deposit. Cleaning the underside of the stencil is a critical enabler to yield improvement. The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.

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