日前，Indium公司的Indium 5.1AT 无铅焊料在NEPCON China 2007上获得了创新奖。该奖项由EM Asia组织评选，用以表彰亚洲电子行业最具创新性的产品。 This is the third award for Indium Corporationrsquo;s Indium5.1AT Solder Paste. It was awarded the Global Technology Award in 2006 and the 2007 SMT China Vision Award earlier this year. It is the second consecutive year that Indium Corporation has been recognized with an award by EM Asia Magazine. Indium Corporation won an Innovation Award for its NF260 No-Flow Underfill in 2006. Indium5.1AT is an air-reflow, no-clean solder paste that provides increased finished goods reliability when compared to competitive solder pastes.
It features ultra low voiding (in the 5% range) when soldering BGAs with micro via-in-pad designs. No other solder paste is known to exceed this level of performance. In addition, Indium5.1AT was specifically formulated to minimize the impact of downtime on printed deposit volumes, ensuring a consistently high reliability on board assembly.
This gives customers increased reliability while at the same time saving them money. To learn more about Indium5.1AT visit www.indium.com/indium51ATIndium Corporation is a four-time Frost Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the worldrsquo;s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
