EMAsia-China.com | 封装与互联Copyright 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.型号：Hysol QMI5100和QMI5200 • 用于流水线金线键合工艺，特别 用于堆叠式金线应用 • 通过操作将金线薄膜和封装胶带 在成分和功能上合为一体 • 融合后材料不留下任何痕迹，便 于键合厚度控制，去除通常合金 ....http://www.emasia-china.com/article.asp?id=3628Speakers at the International Wafer-Level Packaging Conference (IWLPC) that was held November 1-3, 2006, at the Wyndham Hotel - San Jose (CA), addressed issues in semiconductor packaging, chip scale packaging, ....http://www.emasia-china.com/article.asp?id=1536基美公司 (KEMET Corporation)日前推出一种新型的利用软终端 (soft termination) 来帮助减少电容板挠裂可能性的片式多层陶瓷 (MLCC) 电容器。这种创新型电容器将于2007年第一季度上市。 因电容板装配和处理所导致的 ....http://www.emasia-china.com/article.asp?id=1440 “过孔（VIA）”表示“垂直互连”，指集成电路金属层之间的连接。英飞凌与雷根斯堡应用科学大学（FH Regensburg）合作开发出该全新方法。该合作项目是英飞凌Automotive ExcellenceTM计划的一部分，该计划于三年前启动，旨在满足汽车行业苛刻的质量要求。 ....http://www.emasia-china.com/article.asp?id=1421NXP 半导体是业界第一家超薄智能卡 IC的批量供应商，其IC甚至比人的头发和纸张还要薄。如今，NXP 广为认可的 Smart MX 系列芯片可实现仅有 75 微米（0.000075 米）的厚度，只有当前智能卡IC行业标准的50%。在此基础上，NXP ....http://www.emasia-china.com/article.asp?id=13329月22日,由环球仪器公司（Universal Instruments）、维多利绍德公司（Vitronics-Soltec）、DEK公司、汉高电子（Henkel Electronics）、KIC公司和OK国际公司（OK International）等6家全球领先的电子制造业设备与材料厂商共同举办的“2006年先进工艺及无铅应用技术高级研讨会”在苏州工业园区召开。来自电子制造业的著名厂商的近80人参加了此次研讨会。 ....http://www.emasia-china.com/article.asp?id=1094Four experts in integrated circuit packaging will offer half-day workshops at the International Wafer-Level Packaging Conference (IWLPC) on November 1, the kickoff day for the conference. Workshops include ....http://www.emasia-china.com/article.asp?id=1082IPC has announced that six positions on IPC's Board of Directors will be up for election at the end of this year. Candidates are currently being sought to fill these spots. This fall, the IPC Nominating ....http://www.emasia-china.com/article.asp?id=1051As the saying goes, they do things big in Texas and IPC – Association Connecting Electronics Industries® did just that as it honored 51 members for their contributions to the association and the ....http://www.emasia-china.com/article.asp?id=1050A panel of expert industry analysts will discuss key business and marketing issues in wafer-level and integrated circuit packaging at the third annual International Wafer-Level Packaging Conference (IWLPC). ....http://www.emasia-china.com/article.asp?id=977