Adhesives/Coatings/Encapsulating Materials |
Loctite Cornerbond 3508 is lead-free compatible Cornerbond formulated specifically for use with today’s advanced CSP and BGA packages. Loctite Cornerbond 3508 is engineered for process optimization with curing taking place during normal lead-free solder refl ow and allowing for self alignment of IC components. Loctite Cornerbond 3508 is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. The in-line dispensing and refl ow curing capabilities speed assembly and reduce costs through the elimination of post-reflow dispensers and curing operations. |
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 Company: DEK UK
Product: Cyclone Precision Under Stencil Cleaning System
With the convergence of miniaturization and lead-free manufacturing, proper cleaning of the stencil becomes important for high-yield production. However, with the higher viscosity of lead-free materials combined with ever-smaller aperture sizes, cleaning stencils thoroughly and without sacrificing cycle time is difficult. DEK’s environmentally friendly Cyclone precision cleaning technology alleviates this challenge and enables the fast and thorough cleaning of advanced stencils. Its multiple action cleaning process enhances productivity, and provides significantly improved speed and throughput rates. |
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Cleaning Equipment |
 Company: Aqueous Technologies
Product: SMT1000-QUAD Multi-Batch Automatic Defluxing System
SMT1000-QUAD Multi-Batch Automatic Defluxing System is a multiple-chambered, fully automatic defluxing system that is capable of removing all post-reflow flux residues. Unlike single-chambered, batchformat defluxing systems, Multi-Batch technology uses multiple process chambers that allow for multiple synchronous or asynchronous batch defluxing processes. |
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Cleaning Materials |
Company: Aqueous Technologies
Product: Simple Green Stencil & Misprint Cleaner
Simple Green Stencil and Misprint Cleaner is an innovative cleaner that combines effective results with a high level of user and environmental safety. The cleaner offers users the ability to remove all solder pastes including rosin, water soluble, no-clean, lead and lead-free from stencils, screens and misprints. Simple Green Stencil & Misprint Cleaner is designed for easy, straightforward use and implementation, and is for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners. It is also available in a trigger spray for manual stencil cleaning applications. |
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Contract Services |
Simple Green Stencil and Misprint Cleaner is an innovative cleaner that combines effective results with a high level of user and environmental safety. The cleaner offers users the ability to remove all solder pastes including rosin, water soluble, no-clean, lead and lead-free from stencils, screens and misprints. Simple Green Stencil & Misprint Cleaner is designed for easy, straightforward use and implementation, and is for use in immersion stencil cleaning systems such as ultrasonic stencil cleaners. It is also available in a trigger spray for manual stencil cleaning applications. |
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Dispensing Systems/Equipment |
 Company: Ovation Products
Product: Active Stencil System
The Active Stencil system enables users to transform any in-line screen printer (with 29” x 29” frame capabilities) into a highly accurate fluid dispensing machine in just minutes and back to a screen printer just as easily, meeting a significant industry challenge. With Active Stencil, dispensing capabilities may be added to an existing SMT assembly line without using additional floor space. |
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Environmentally Friendly Products/Services |
 Company: Kester
Product: Ultrapure K100LD Lead-Free Solder Alloy
Kester’s Ultrapure K100LD is an innovative lead-free bar solder alloy for the electronics industry. K100LD is a low-cost alternative to traditional silver-bearing lead-free alloys, primarily containing tin and copper with the inclusion of two metallic dopants to control the grain structure and the copper dissolution rate. The lack of silver holds the material cost to an absolute minimum for lead-free soldering. The lack of lead and silver in K100LD makes this product one of the most environmentally responsible bar solder alloys available. |
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Identification (ID) Systems |
 Company: Polyonics Inc
Product: Color Polyimide Labels
The color polyimide labels are coated with a permanent pressure-sensitive acrylic adhesive and a high opacity, medium gloss topcoat available in 6 tinted colors. They are thermal transfer printable and scan with both visible and IR scanners, which increases a user’s overall quality and consistency of performance. Barcode labels made from these colored polyimide materials demonstrate excellent environmental performance in lead-free wave solder environments, which range from 260o to 290oC. |
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Inspection Equipment – AOI |
 Company: Vi Technology
Product: Vi-3K Series Dual Lane AOI/AOM Systems
The Vi-3K series of upgradeable AOI/AOM systems are available in a dual lane format. These new systems have been designed to be compatible with the latest state-of-the-art dual lane pick & place systems, equipped with asynchronous conveyors. Due to the masked transport time and reduced travel time of the inspection head, these systems provide costs reduction and ROI maximization due to the increase in production and throughput. The Vi-3K Series Dual Lane systems are able to handle either the same product on both lanes, or completely different products on each lane. |
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Inspection Equipment – X-ray |
 Company: Dage Trading (Suzhou) Co. Ltd
Product: DAGE-XD7600NT 3D-CT X-ray Inspection System
Dage developed a computerized tomography (CT) option for its XiDAT XD7600NT digital x-ray inspection system, which further refi nes its performance with volumetric reconstruction of solder joints. This option is suited for the analysis of interconnections for applications such as stacked die, MEMS, package-in-package and package-on-package. The XD7600NT equipped with the CT option has the ability to convert between 2D and 3D modes for different inspection applications and reconstruct a high number of image slices up to 1,440.
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Manual Soldering Equipment |
 Company: OK International
Product: MFR Series – Multi Function Rework Systems
OK International’s Multi Function Rework System (MFR) is designed to meet every production soldering, rework and desoldering requirement – all from a single benchtop platform. Featuring a wide range of high precision assembly tools and tip technologies, the MFR Series is equipped to deliver reliable, lead-free connections for the highest standards of quality and throughput. In addition, the systems easily adapt to the varying workloads of rework applications, SMT tasks and through-hole soldering and desoldering.
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Pick and Place Systems – Automated |
The new SIPLACE D-series platform features a combination of innovative technology coupled with innovative value. It covers standard and high-performance needs of electronics manufacturers equally. Based on a standardized platform, the SIPLACE D-series masters any speed and flexibility requirements with its compatibility and configuration options. If necessary, production lines can be easily expanded. Depending on the combination of gantries and heads required, four different versions are available.
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Programming |
 Company: BPM Microsystems
Product: HELIX-TR Programming System
The Helix-TR system provides the quality of automated device handling less expensively because it offers two precision-designed tray input and output handling systems with a reject location. A desktop automated system, Helix-TR is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BPM Microsystems automated line. The pressure plates are exchangeable between the two units.
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Reflow Soldering Equipment |
 Company: BTU International
Product: Pyramax 98N Solder Reflow Oven
Designed for SMT reflow, curing and semiconductor packaging, Pyramax 98N is leadfree process guaranteed, featuring up to 400oC maximum temperature, closed-loop convection control and a comprehensive warranty program. The system also features BTU’s patented Flux Management System, which traps flux residue from the process chamber, preventing it from settling within the oven, and leading to increased uptime and lower cost-of-ownership. Easy access to filtration and trap arrangement, and multiple extraction locations that maximize overall quality and consistency as well as “on the fly” maintenance that eliminates downtime further contribute to the system’s performance.
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Repair/Rework Equipment |
 Company: VJ Electronix
Product: Summit 2200 Advanced Rework Station
Summit 2200 is engineered for the most demanding lead-free processes. Using many of the Summit 1800 components and processes, the 2200’s advanced features include new automated site prep (scavenging) system, automatic and vision assisted placement, wide area profile storage compatibility, new bottom heater and motorized table, and new integrated technical documentation.
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Software – Process Control Systems |
 Company: KIC
Product: KIC Vision System
KIC Vision is an automatic profiling system that eliminates manual verification profiling. This low-cost system is designed for those customers that want to eliminate the manual tasks associated with periodic profiling for their reflow ovens. Although such profiling has been important for production quality as well as process documentation, many electronics manufacturers are burdened by the negative effects of such manual tasks. By being automatic, the new vision profiler meets the industry challenge of uninterrupted profiling, which also results in increased speed and throughput rates.
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Software – Production Management Systems |
 Company: Sony TiMMS
Product: Totally integrated Manufacturing Management System (TiMMS)
The Totally integrated Manufacturing Management System (TiMMS), is a fully integrated CIM system designed for the electronics printed circuit board manufacturing industry, focusing on demand chain management. TiMMS provides the “missing link” in the traditional supply chain, bridging the IT and manufacturing divide. TiMMS communicates directly with the shop fl oor production processes in real-time, providing full traceability for parts and processes. This sophisticated production management system is built for Windows NT/2000/XP, and includes a suite of Java-based tools, enabling a view to the entire production area through a standard web browser on any platform.
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Soldering Materials |
 Company: Indium Corporation
Product: Indium 5.1AT Lead-Free Solder Paste
Indium5.1AT is a no-clean, lead-free solder paste that provides increased finished goods reliability when compared to competitive solder pastes. Indium5.1AT delivers voiding in the 5 percent range over many different profiles when soldering BGAs with via-in-pad technology. It offers a robust processing window that can minimize potential defects such as poor wetting, solder balling and shorts as well as accommodate various board sizes, board densities, and throughput requirements. Indiumt5.1AT minimizes the impact of downtime on printed deposit volumes, ensuring a consistently high reliability on board assembly, specifically for CSP components.
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Test Systems/Equipment |
 Company: Agilent Technologies
Product: Agilent Medalist Bead Probe Technology
Agilent Bead Probe Technology is a technology for placing test targets directly on printed circuit board (PCB) signal traces. These beads then serve as highly reliable test points for use during in-circuit testing (ICT). This new technique dramatically improves ICT access on high density and high-speed boards, resulting in excellent fault coverage. This innovation brings about improved test access, reduction in manufacturing costs and faster time.
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Wave Soldering Equipment |
 Company: Speedline Technologies
Product: Electrovert VectraES Wave Soldering System
Speedline Technologies’ Electrovert VectraES brings innovation and process flexibility to the three main subsystems of the wave soldering machine; the fluxer, preheat and the solder module. The new ServoSpray, servo-controlled reciprocating spray fluxer features an air atomized spray head, pressurized tank flux supply system, self-cleaning nozzle capability and the flexibility to spray in one or both directions via recipe control. Collectively, these features enable the ServoSpray to deliver good hole penetration and spray uniformity with a wide range of fluxes.
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Best Supplier of the Year (Reader’s Choice) |
Kyzen Corporation, a provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, was awarded Best Supplier of the Year. The winner was voted by the readers of EM Asia and EM Asia-China, based on product availability and product ease of use; maintainability and repairability; technical support, training support, speed and throughput improvements, as well as service quality; and overall product satisfaction and product brand awareness.
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EM Asia Innovation Awards
