Ready for Industry 4.0. As a pioneer in implementing smart factory solutions into SMT inspection Viscom is determined to further the integral optimization of the SMT line for maximum process efficiency and high process stability. To attain this goal, Viscom’s Quality Uplink offers an array of smart interfaces and software tools that automatically link inspection information from the inspection systems for analysis and where desired, exchange it with third-party systems effortlessly. Visitors can get a real-life impression of these smart factory applications at the Dream Factory Demo-line in zone 1T40 where the entire production process is realized in an interactive way. Visitors can place a personalized order of a sample product on their smart phone and follow the entire production process.
On the Viscom booth visitors can also experience further industry 4.0 applications hands-on. In partnership with the IPC Connected Factory Exchange (CFX) initiative Viscom has linked their systems to the CFX cloud through which standardized IoT data from the Viscom machines is being transmitted to the visitor’s personal mobile devices. Real-time analytics reports, such as OEE (overall equipment effectiveness), unit counts, as well as the live data stream showing actual events occurring on the systems can be observed in real time.
Next generation 3D AXI @ cross-linked and smart
Like all Viscom systems, the new X7056-II 3D inline AXI is developed to seamlessly integrate into the production line and to facilitate intelligently cross-linked Industry 4.0 and smart factory applications. It is the completely redesigned successor of Viscom’s very successful X7056 series which has gained widespread recognition by the world’s most advanced electronic manufacturers. It comes packed with innovative new hardware and software features and has been awarded multiple industry awards in Europe, the U.S and Asia. Equipped with the innovative xFastflow high-speed handling system, the X7056-II is now capable of processing 3 PCB’s simultaneously reducing the handling time (board infeed and outfeed) to under 4 seconds. Due to the time saved, 3D inspections, which used to be done selectively, can now be expanded to cover far more than just individual components. Shorter cycle times and excellent inspection results lead to reduced costs, higher output, and less product rejection, which in turn minimizes environmental impact like unnecessarily high scrap amounts. Furthermore, new state-of-the art planar CT software algorithms allow for highly accurate 3D digital reconstructions of the solder joints. Interfering structures are reduced most effectively. Layers from double-sided PCB’s with complex overlap of components can be conveniently extracted and defects can be revealed more precise and easier than ever before.
The X7056-II thus constitutes a real advance in inspection quality and speed and in combination with the smart factory applications a powerful and future-proof solution.