Rocket EMS Inc., a Silicon Valley-based full service EMS supplier, today announced that it has installed two V510 G2 Advanced Optical Inspection (AOI) systems and one V810 S2 3D In-line Advanced X-ray Inspection System (AXI) from ViTrox Technologies. The V810 S2 and V510 G2 systems will complement Rocket EMS’ SMT assembly line with high-speed, high coverage AXI and AOI.
“At Rocket EMS we promise extraordinary quality, spectacular customer service and a sense of urgency in everything we do,” commented Craig Arcuri CEO of Rocket EMS.
Peter Chipman, Vice President of Test, Rocket EMS, added: “Rocket has used ViTrox AOI and AXI machines for many years. We chose the ViTrox machines based on our experience with reliability, ease of programing and the machines ability to successfully capture production problems.”
The V810 S2 accommodates boards up to 18"x24" and offers Rocket EMS the ability to inspect double-sided PCB panels with high defect coverage, high inspection speed and an excellent call rate. The system is designed for in-line and offline use and works on both lead and lead-free solder joints. The V810’s state-of-the-art technology is based on Digital Tomosynthesis methodology and runs on a new platform with Windows 8 Professional 64bit.
V810 S2 is incorporated with state-of-art new technology of Scan Path Merging (SPAM) that can reduce the inspection time and hardware scanning path. Single Unified Management Office (SUMO) uses an 8-core processor with 128GB of RAM that accelerates the system to its optimum level of performance. Simultaneous Efficient Reconstruction Technique (SERT) and a new 64bit imaging processor architecture combine Predictive Slice Height (PSH) into a single scanning path. Phase Shift Profilometry 2 (PSP 2) boosts the projection and image acquisition speed up to 10 times faster using an in-house proprietary projector. PSP 2 improves accuracy and test coverage on 100 percent pressfit and PTH boards.
The test coverage of V810 S2 is improved through nonlinear reconstruction technology for highly shaded connectors such as the eight layer GBX connector and power transistor. The new Floodfill Voiding Algorithm enhanced the accuracy and various detection types for voiding. The V810 S2’s wide vision increases the reconstruction region to 3 x 3" allowing users to view the entire component at one glance. ViTrox V810 S2 is coupled with advanced package inspection including three layers POP, pin in paste, solder charge, etc.
The new generation cost effective V510 G2 Series AOI system offers greater performance for faster inspection with inspection speeds up to 55 cm2/sec for post-reflow and 65cm2/sec for pre-reflow. The system features low power consumption with a brilliant LED monitor display and improved ergonomic adjustment to increase viewing comfort (sit-stand operation). Additionally, the new multi-shot imaging technology enables the system to capture up to 180 frames per second and the multi-core processing technology significantly enhances inspection time.
For more information about ViTrox’s vision inspection systems, visit www.vitrox.com.