Metcal announces that it will highlight the MX-5200 Soldering, Desoldering and Rework Series at the SMTA Intermountain (Utah) Expo & Tech Forum, scheduled to take place Thursday Oct. 23, 2014 at the University of Utah in Salt Lake City, UT. The MX-5200 features a dual-simultaneous use option, meaning that two hand-pieces can work from one power supply at the same time.
Four different hand-pieces and a comprehensive range of soldering and rework cartridges support the MX-5200 Series simultaneous dual operation. These include the Metcal Advanced™ Hand-Piece for SMD rework, a Metcal Ultra-Fine™ Hand-Piece for fine access, a Precision Tweezer capable of removing a range of components from 0201 chips to 28mm SOICs, and a Desoldering Gun for safely removing through-hole components.
Additionally, company representatives will discuss Metcal’s full line of solder fume extractors and convection rework systems. Metcal’s Array Package Rework systems are advanced, versatile machines offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today’s leading-edge BGA, CSP, LandGrip Array (LGA), micro SMD, Micro-lead Frame (MLF) and Bumped Chip Component packages.
For more information about Metcal, visit www.metcal.com.